bga vs qfp

On the right is the QFN. Thanks, Sheldon. tolerances. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.BGA packages are used to permanently mount devices such as microprocessors.A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.The whole bottom surface of the device can be used, instead of just the perimeter. It indicates that the transfer ratio of solder . First … For a scope probe no problem, but for a DMM you'll need needle probes. QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch Fine pitch requirement QFP 0.4 mm pitch Bare chip (flip chip) • Infra. This concept is a natural extension of the roadmap of packaging: take a 100mil center PGA pack-age and reduce the grid pitch. 144p QFP . Notice the way I had to route the QFN versus the QFP. The package body can be made smaller than QFP and the BGA does not have to worry about pin deformation problems like QFP. BGA vs PGA. Quad Flat Package (QFP), Ball . Safety features • Supports Lockstep • Memory Protection Unit (MPU) • Error-Correcting Code (ECC) Higher performance BGAs with 1.27 mm pitch (distance between adjacent ball centers) are the only choice for Performance: With the pins spread out on the bottom of the BGA, the internal wires connecting the die to the pins are much shorter than they are in a DIP or QFP package. issue (KGD) • Soldering difficulties • PWB/ASSY cost up CSP (chip scale pkg.) But the BGA needs X-ray for inspection, and the assembly shop may charge extra for that. This research provides valuable data because, very little data is available on solder paste volume tolerance limits in terms of assembly yield and reliability. Guest. SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. Abstract— Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. A BGA package is more advantageous at design layout because it provides increased functionality at the same package size compared to the Quad Flat pack (QFP). 3MB Flash . The standard form is a leaded plastic package with a flat rectangular body, usually square. 9 . High pin counts can lead to high track density, so take care to ensure you follow design rules. Figure 8: BGA and LGA visual and X-ray inspections The average BGA solder joint stand-off was measured to be 0.206mm (0.190-0.212mm) where the LGA was only 0.048mm (0.021mm- 0.066mm) (Figure 9). DFM Rules for BGA’s . X-ray Image . Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices. BGA is defined as a chip carrier that is generally used in ICs and makes use of surface mount type of technology. 144p QFP 337p BGA . 256kB RAM . Leads extend from all four sides of the body. In case you want to mount your microcontrollers and microprocessors, then you should make use of these BGA packages.They will provide you with a large number of interconnected pins, much more than what is offered by the flat ones. ... VI. Presented By: Dale Lee E-mail: Dale.Lee@Plexus.Com August 2012 DFM Guidelines for BGA’s and ... (SMD vs NSMD) – Paste Volume Control •Pad to Pad Volume •Pad to Design Defined Volume ... etc) and Leaded (QFP, SOIC, SOT, etc.) Figure 9: BGA and LGA solder joint stand-off Self Alignment Evaluation of LGA vs. BGA To investigate the robustness of the surface mount process Ball-Grid Array (BGA) Ceramic Pin-Grid Array (PGA) FineLine BGA (FBGA) Hybrid FineLine BGA (HBGA) Plastic Dual In-Line Package (PDIP) Plastic Enhanced Quad Flat Pack (EQFP) Plastic J-Lead Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP) Power Quad Flat Pack (RQFP) Thin Quad Flat Pack (TQFP) Ultra FineLine BGA (UBGA) QFP packages with a heat sink. A BGA package also offers better thermal and electrical performance. and Figure . Transfer efficiency numbers for both good assembly yield and good reliability are reported for LGA, QFN and BGA devices. For BGA, LGA, QFN, QFP, and other variations of SMT packaged device types, with our without leads and down to 0.2mm pitch. Con­ trol of the amount of solder paste deposited is critical in the case of Thermal design: introducing various actions,lowering the thermal resistance of a package, taking representative package types, QFP and BGA, as examples. (for high power device) Quad Flat L-Leaded Package with Heat Spreader QFP packages with built-in heat spreader. 10. On the left is the QFP. 1. 300 MHz MB Flash RAM. The plastic Ball Grid Array (BGA), including Low-profile Ball Grid Array (LBGA), Low- ... QFP. JEDEC matrix IC trays for BGA, QFN, QFP, TQFP, LQFP, TSOP, PLCC. Cortex-R: Ideal for safety-critical applications . Components – Near Toe Fillet . The operation is the same for both: pick and place. However, there are other considerations if BGA and QFN/QFP ICs are involved. Why do you think the BGA is cheaper in assembly? array for pads on a 50mil grid, a BGA with just 70 leads or more has a smaller footprint than an equivalent 25mil pitch PQFP. Reusable. It improves the ratio of pin count to board size, hence providing more connections and increased area for routing. This unit is perfect for temperature-sensitive components such as the SOIC, CHIP, QFP, PLCC, and the BGA, where you need precise temperatures to keep the circuit intact. 180 MHz . The QFN also lets you reach the pins with a probe. WLCSP Sockets Designed for fragile wafer-level packages using low force pogo pins and a floating base architecture for device alignment. The QFN can be visually inspected. BGA Vs QFN. QFP BGA CSPs Figure 1 Miniaturization trends in surface mount electronics packaging, from quad flat pack (QFP) to ball grid array (BGA) and chip scale package (CSP) Figure 1 compares a conventional leaded package with BGA and smaller configuration CSPs. (for high power device) Thin Quad Flat L-Leaded Package Thin QFP packages have the package body heights (mold thickness) of 1.0 mm and of 1.27 mm. Posts Reply to this topic. Jianbiao Pan, Member, IEEE, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri . Grid Array (BGA), ... for QFP apertures and BGA apertures are shown in Figure . Manufacturers often use ±50% of stencil Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options. November 24, 2014 at 1:52 pm #1665. sheldon_r. The Tek Motion’s workstation is too noise-reducing and space-saving with the following dimensions: 10.2 x 6.7 x 5.9 inches. | 9 November, 1999 Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. EDIT: added link and explanation of two layouts I have done that demonstrate the major differences between the QFN and QFP My last BGA board used 0.1mm traces width and spacing (4/4) with small vias. This application note provides guidelines for handling J-Lead, Quad Flat Pack (QFP), and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA packaging) devices to preserve the quality of these devices during storage, shipment, and transfer 337p BGA. 337p BGA 570LS31 . This allows for smaller package sizes for the same number of pins compared to traditional dual in-line or quad-flat-pack parts. Although QFP technology is also making continual progress and is capable of dealing with components with pitch as low as 0.3mm, the decreasing pitch gets assembly pass rate reduced to some extent. Low Profile Quad Flat L-Leaded Package (2-2) If the BGA pitch 0.5mm, then the aperture size should be 95% of the pad’s size. (2-3) For a 0.4mm pitch QFP, the aperture width should be 85%, length 110% (extended). Micro-BGA and Fine-Pitch QFP. QFP SQFP High Performance FDH-BGA TAB-BGA EBGA TEBGA FC-BGA High-speed COC High-speed H-SiP PGA BGA Enhanced BGA 2 IC-package_E.fm 2 ページ 2011年1月27日 木曜日 午後5時44分 WL-CSP QFN Ultra thin technology Fine-pitch technology Fine wiring Bump technology Design technology CoC technology QFP BGA/FBGA FC-BGA System in Package BGA devices in ATC. Re: BGA vs. QFP Packaging. Ball Grid Array (BGA) Soldering. Viewing 1 post (of 1 total) The … The circled layouts are the same 40 pin PIC. BGA Layout gets a lot more difficult as the pitch becomes very small (0.5mm for example) or when the pin matrix is full. The Quad Flat Package (QFP) is a surface mount integrated circuit package. Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine-Pitch QFP May 2004 IEEE Transactions on Electronics Packaging Manufacturing 27(2):125 - 132 Stackable. The leads are formed in a gull wing shape To successfully solve this issue, BGA (ball grid array) technology comes into being and receives a wide range of focus from the industry. Dear all, we have a new ASIC project that will dissipate 5W-6W, would that fit into a QFN package? • Resolution and smearing problems with respect to the stencil-print process are less because the pitch is larger, and the apertures are circular. Author. Accordingly unwanted lead inductance levels are lower, and in this way, Ball Grid Array devices are able to offer a higher level of performance than their QFP counterparts. This costs about twice as much per sq inch (or mm) than a 7/7 (0.2/0.2) board which might be appropriate for a QFP design. QFP packages have a high number of pins and thus enable large number of connections with rest of the PCB. BGA package types In order to meet the variety of requirements for different types of assembly and equipment, a number of BGA variants have been developed. 2 SMTA Journal publishes much relaibility study information. QFP packages can have pins ranging from 32 to over 300 pins with pin pitches between 0.4mm and 1mm. (2-1) If the BGA pitch >1.0mm, then the aperture size should be a 1:1 scale opening. BGA is soldered on to any Types of PCB using a reflow oven. Do you think the BGA is soldered bga vs qfp to any Types of PCB a... And reduce the grid pitch architecture for device alignment and increased area for.! 1665. sheldon_r total ) the … 1 for routing other considerations If BGA and ICs. 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