There are solder balls at the bottom of the device. In addition, BGA is technically not a socket because it is a permanent motherboard function. (You can easily replace an LGA or PGA CPU.) 2. For more information regarding our services and solutions contact one of our sales representatives. If you have questions regarding one of our products provided by e.g. Not all rows and columns of the grid need to be used. Scope of use is different. Intel LGA sockets would be phased out after the fourth-generation Intel Haswell CPUs. data for ball grid array (BGA), land grid array (LGA), and ceramic column grid array (CGA). Intel LGA sockets would phase out after the 4 th generation Intel Haswell CPUs. BGA is mainly used in notebook CPUs and smartphone CPUs, such as AMD low-voltage mobile processors, all mobile phone processors. The specified as-shipped BGA thickness should be 0.060mm greater than the specified as-shipped LGA thickness. Ball Grid Array (BGA) The abbreviation BGA stands for "Ball Grid Array". �y暽#�J��@7����v�c_��t�^��0䎘T��
����u�Q��rnq)vT��|MnPƈ��=�@~^*)R�}�H�?p��GPT�F�Jd�}�y�E�z;w��L�$�>�1��vE�1� �T������o�R����%� Earlier Intel CPUs, such as the Pentium, Pentium 2, and Pentium 3 all used a PGA socket. You can normally change an LGA or PGA CPU. Soldering a ball grid array. The terms BGA, PGA, LGA and CCGA are name types of integrated circuit packaging. LGA 1366: This socket, or Socket B, is a newer, more advanced version of the LGA 1156. Delivering on its promise to innovate best-in-class technologies to the M2M and IoT marketplace, Gemalto introduced Land Grid Array (LGA) surface mounting technology in 2010, and it has since become the industry's gold standard. 1.1 Freescale Semiconductor 5 3 Benefits of LGA Some benefits of the LGA package over a BGA package include: • LGA devices can be used for either lead containing or lead-free assemblies depending on the Comparison – LGA vs PGA Pad size and level pitch enable customer-specific overprinting for excellent yield rate and optimal performance. Like the LGA 1156, the first version (LG 1366) featured an Intel Core i7 in 2008 and last used in 2011. If you look at BGA and LGA package footprints, they look very similar, but there are some key differences. LGA is Land Grid Array. We have agents worldwide that are available to help with your digital security needs. Ball Grid Array (BGA) components provide a huge increase in available interconnects without the troubles associated with bent leads. LGA modules feature an optimized circuit footprint and pad size with a versatile geometrical layout that allows customer choice of soldering paste, different grades of overprinting and precise soldering results. At the end of the day, any good bga or mga has a direct contract with the carrier, unlike smaller mga's who have a contract through another mga. 1.1 Freescale Semiconductor 5 3 Benefits of LGA Some benefits of the LGA package over a BGA package include: • LGA devices can be used for either lead containing or lead-free assemblies depending on the LGA (Land Grid Array) LGA. Also for signal integrity reasons BGA seems to be preferred since bypass caps can be placed ‘better’ and lead inductance is obviously less. The LGA height increases by 0.025mm after SMT. The LGA package is a standard flip-chip Ball Grid Array (BGA) shipped with no spheres. The BGA height decreases by 0.035mm after SMT. In this package, small solder balls form the connections, which are arranged in a square grid made up of columns and rows on the bottom surface of the chip. 1,000 10,000 It is shown that a BGA package should be specified with a 60um greater as-shipped thickness to end up with the same mounted height as an LGA … BGA (Ball Grid Array) components are mostly used for microprocessors or flash memories. Residues of flux on module ball surfaces can reduce the yield rate impending performance of the module. BGAPCB Assembly Services Chicago, Illinois USA. I … PGA is Pin Grid Array. From what I’ve seen Ryzen CPUs still have pins on the CPU (PGA), contrary to Intel who puts pins on the MB (LGA). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. The pins are on the chip. Soldering paste must be applied with extreme precision to fit balls of solder that are already fixed on the module. The contacts are to be connected to a grid of contacts on the PCB. BGA sockets are still worth mentioning since it serves the same function. lifesettlementadvisor, Feb 1, 2010. lifesettlementadvisor, Feb 1, 2010 #2. However, they differ in the type of connections. BGA's are by far much easier to process correctly and inspect. Cite. your bank or government, then please contact them for advice first. 111 0 obj
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This just seems a lot more fragile than LGA. Posts: 3,334 Likes Received: 46 … BGA is "Ball Grid Array"; LGA is "Land Grid Array ". The contacts can either be made by using an LGA socket, or by using solder paste. {�4,\z(�3�,ꃘ���/}��/�-�2�42��2=�����,x�H)}y��XI����1�nCo3 ��e��g�Kݽv�`}R�P� w�wޘ@V^c"4\/d>oI~�����%`-d�Sߣ�Lzf�2�^�%�d�j�_��d�����cq�&i�֜�����5�%���|/m�@����FxiA�(�MFÜ8�L4�Q����� Heat must be applied to fix balls of solder onto the module. %%EOF
The overall package size of a CSP is typically no larger than 1.2 times the size of the silicon. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. These CPUs are soldered directly into the motherboard (embedded) which makes them extremely difficult / impossible to replace the CPUs without proper equipment. Fill out our contact form and one of our representatives will be in touch to discuss how we can assist you. Share. LGA is Land Grid Array. Freescale is now introducing the LGA … LGA on the other hand offers a much firmer and safer anchorage, which does put pressure on the pins and guarantees a more equitable distribution of it. The flat design optimizes customer application. A BGA socket and a motherboard may cost less, but there are very few equivalents between consumer BGA products and LGA and PGA. A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. Instead, equal numbers of contact pads are on the CPU to make connection. As is shown in reference [1], this increase in die size will result in about 2X reduction in life under bend cycling. Freescale is now introducing the LGA … Ground pads underneath the RF components reduce the effect on the antenna path. 86 0 obj
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The as-shipped vs. mounted height of BGA and LGA packages was compared for a typical RF module design rule set. Volume is different. Residues of flux lead to passivation, or reduced conductivity of the balls. Share. I don't think you will find them any easier to use than BGA. The copper layer of a SMD BGA pad typically has a diameter equal to the diameter of the pad on the BGA itself. Improve this answer. %PDF-1.5
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These solder balls melt during soldering and make the connection between the PCB and component. LGA has been available for hand-held devices in the small plastic package from Freescale and others for severa l years. Optimized pad size enables customer-specific overprinting for excellent yield rate. Scope of use is different. Connections would be critical near to the corners and in the middle. Rather than redefining component layouts, the LGA design functions as a standard flip-chip Ball Grid Array (BGA) but without spheres. In this article, BGA refers to a 35-mm or larger device with 760-µm solder balls. Figure 1 shows the top and bottom sides of an LGA device. A wide range of soldering pastes may be used so that solder material selection is based on customer needs and processes. �{��H���R�d����'��D��s@����(y��s�p�gry� �*«�5w��O���S��(�"��Ǐ|�����sӭ���qw+���j�=�SW[���V���MD/�i�ۜS {!��C�zA��/�°?O�\=�q�~��W���]�w�������۞�����P-"nq��t��v��]zk6h�]�4^1"�Z1��^���70���.7c���]F��h�0Gl{�a�~��+� ��h�
BGA is for CPUs that will be soldered into place (think laptops and consoles). LGA is similar to BGA, but without the solder balls, so you have to apply solder paste to the pads with a stencil. PGA is the other way around. As for LGA's you'll never get 100% of the materiel out from under it during the cleaning process. Accounting for this difference, it seems that the joint reliability of LGAs in this case is about the same as their BGA counterpart for this particular package. Cite. As is shown in reference [1], this increase in die size will result in about 2X reduction in life under bend cycling. Follow answered Feb 4 '11 at 13:17. BGA package is small in size, and LGA is larger than BGA package; 3. In addition, BGA is technically not a socket because it is a permanent motherboard function. The BGA technique permanently attaches the processor to the motherboard during production, making upgrades impossible. The pins are on the chip. There is also a BGA socket, which stands for "ball grid array". TR4 is only AMD's second LGA socket. Command and Control Centres - Air Operations, Cloud and outsourced IT services for critical information systems, ITSEF | Security and Reliability Evaluation, Geonav IoT: a precise positioning solution for both outdoor and indoor environments, Transformation for Better Competitiveness, Flight deck, avionics equipment & functions, Helmet-Mounted Display for helicopter, aircraft and fighter missions, Thales autopilot solutions for aircraft and helicopter, Digital solutions for aircraft operations, Avionics equipment maintenance, repair and overhaul, Communications & Supervision for Urban Mobility, Communications & Supervision for main line rail, Ticketing & Revenue Collection for Urban Rail, Cybersecurity for the railways infrastructure. different die size; 13x13mm for the LGA vs. 9.5x9.5mm for the BGA. Follow answered Feb 4 '11 at 13:17. A unique layout of LGA pads provides optimized heat dissipation. The current 7th generation CPUs use LGA 1151 socket, which there are 1151 contact pins on the socket. LGA, PGA, BGA are the most popular ones used in consumer-grade. endstream
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Gemalto's intense research and testing revealed the specific advantages of LGA over BGA (Ball Grid Array) surface mount technology. LGA technology provides the most reliable and flexible surface mounting technology for soldering wireless modules into integrated solutions. LGA is what you're going to get right now. Volume is different. misalignment was higher in the LGA case than for BGA packages. Leon Heller Leon Heller. They provide more connection pins than other SMD components. It is doubtful that a laptop (desktop) with a BGA socket CPU would support other CPU models Preview file 28 KB 1 Kudo Copy link. That said, with the increase in system-on-a-chip … qM�Z(�PCQd1�Ec� All the contact pins are on the socket, soldered to the motherboard. different die size; 13x13mm for the LGA vs. 9.5x9.5mm for the BGA. Considerations for the Application of Land Grid Array (LGA) Style Packages Application Note, Rev. Pad layout contributes to minimizing the impact on the RF part. The voiding issue is magnified with and LGA, the low standoff is the reason for the voids, there's not enough clearance to … However, these new components bring with them serious issues related to board-level reliability at extreme temperatures as seen in industrial, military, and space environments. j>��Q�;B��:L��z \C���iHSECdv�ŧ=�����K�pB��M�M*�;
�Wf�8���-�x+����8Nҿ����p��.G�du�����O�9�w�����a�(�f�I�h4�ur�y����|8N՜^������Xw���@�s�gF�5~�}8��tG��H�;�����O%���sp����� �_�ꉝhA�q���ßVr�Z1���Ĉ�Z,��H���=�����F��o={��fiE�s�J�N���OI�h�Q����Z���%�gi�aE���R�k}Yu &� ���2�vk���V��cZ55�tM2ܯDйHσ��3!G��{�>5u���,�\�$%s:uVB�>����h��D�-NY�ỏ��N���R���Bu�ARS�~"�^����ʮ��5��t�a%��-��ƃ��-hEm�u�w%��R�v�I} :R���%�%�e���}������A."���FU��#R~t+ �r� BGA. BGA packages are used to permanently mount devices such as microprocessors. Blank pads offer high flexibility for customer-specific soldering paste. The LGA package is a standard flip-chip Ball Grid Array (BGA) shipped with no spheres. endstream
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Considerations for the Application of Land Grid Array (LGA) Style Packages Application Note, Rev. Ground pads are located underneath the RF components.. 0
LGA is mainly used in desktop CPU packaging, such as desktop processors, AMD Opteron, Opteron, etc. hޤ�[k�0�����L�/�
%��MWX�P�u�%Zb���VY��sd9vh����\%}:�q�g�oF�܌�qhƐx��¬��$,6���CB� Kn�� #tVU��Z����{#ǘ���1�z�ש���S��j�U��b�y�\�,��V��/�j�*����9�ԓ^��Kz3�Me�6$A�Ւ�� k���B���H���I�uA~ʢQF�%���v����y4�sPDziu�����N��*5�Ng��Y�&"L襲����r�?�-N���r�1��`=��&� Please note we do not sell any products nor offer support directly to end users. LGA is what you're going to get right now. h�bbd``b`:$A�7 �\$8� �]@�-��$Xրdk@:�A�@��H�������b``$����� � �
Non-Solder Mask Defined BGA Pads (NSMD) NSMD pads differ from SMD pads as the solder mask is defined to not make contact with the copper pad. PLEXUS CONFIDENTIAL EFFECTIVE PAD SIZE ANALYSIS 0 10 20 30 40 50 60 410 15 20 WIDTH OF TRACE % PAD SIZE INCREASE 10 Mil Nom 15 Mil Nom 20 Mil Nom 10 Mil Max 15 Mil Max 20 Mil Max Trace Routing And Solder Mask Opening Impacts Solder Joint Increased Mounting Pad Size Affected By: It never … In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny solder ball stuck to it. In fact, Land Grid Array is essentially the direct opposite of PGA. Gemalto's intense research and testing revealed the specific advantages of BGA is for CPUs that will be soldered into place (think laptops and consoles). LGA 1366: This socket, or Socket B, is a newer, more advanced version of the LGA 1156. Additional heating is necessary to place the balls to the modules' ground during the manufacturing of the modules. 1��s
2? BGA is Ball Grid Array. Today in this video I am going to explain different types of CPU Sockets. Share. ����~ �c�F@�xe�������V�F���-�m �1<7� It is doubtful that a laptop (desktop) with a BGA socket CPU would support other CPU models Preview file 28 KB 1 Kudo Copy link. (I remember bending several pins on my old AMD CPU back in 2005 or so, and was really worried to break them. To create the SMD overlay, a reduction of 20% is typically used. What I found so far is that BGA is preferred for its smaller footprint, and better assembly yield (0.8 mm pitch BGA vs 0.5 mm pitch QFP). h�b```f``2g`a`Sa`@ �rL2U���Y�:����s00������[��`���BJ
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2. BGA ball height differs by up to 50%, reducing coplanarity and functionality. BGA is "Ball Grid Array"; LGA is "Land Grid Array". LGA vs BGA - which surface-mount tech to use? stands for Land Grid Array, PGA which stands for Pin Grid Array Industry has a wealth of publication on the 2nd level assembly reliability of BGA categories, but a co-author has published extensively on CGAs as well as BGAs within the last two decades [1-12]. A BGA socket is a central processing unit socket that uses a type of surface mount-based integrated circuit packaging called ball grid array. Blank NiAu pads are engineered on the surface of the module. BGA = Ball Grid Array. It is still worth mentioning the BGA sockets since it fulfills the same function. It is still worth mentioning the BGA sockets since it fulfills the same function. The LGA socket on the left contains pads where an IC is attached, while the BGA contains solder balls that attach directly to pads on the PCB. LGA has been available for hand-held devices in the small plastic package from Freescale and others for severa l years. ��Pg��"+A;�Qؕ��ҥ�c�-{�>_��yr�� �xj&�"y>'���Xe=p�%�i�(x��xbBb�x����Ж@���qJ? LGA Package in Thermoformed Tray. Improve this answer. κ���:+R0�!%SC (�iC�����c*����o�RN%�yq��ao[v���]����P���+�.���*���IC:��j��F�e���וU��DXؖ]��e�] The CPU has metal contacts flush on the surface, pins in the socket.
Offline HealthGuy Guru. BGA is Ball Grid Array. The land grid array is a packaging technology with a rectangular grid of contacts, 'lands', on the underside of a package. PGA is Pin Grid Array. Avoid touching. These CPUs are soldered directly into the motherboard (embedded) which makes them extremely difficult / impossible to replace the CPUs without proper equipment. The present study compares the as-shipped vs. mounted height of ball grid array (BGA) and land grid array (LGA) packages for a typical RF module design rule set. endstream
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Land Side Cover. BGA package is small in size, and LGA is larger than BGA package; 3. Due to the temperature profile of the previously fixed solder, customer choice of soldering paste is limited. "�_~�
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Figure 1 shows the top and bottom sides of an LGA device. 'W�t��?�11���|Y���Q��L�Q����cԀ����Tgy�k��EjЧ1��f�"���3_�P�2%�$J��Aޚ��oW�(dѲ��'�W�z��ۼ���W7.��p��Gp��_�8�B"Y?��Xe5�R��Nbt����g�2�T�{^�ص� a�ݸ�@L����gH��v�ڸq����*؛���)@��hM0?�����r�Ց�d�Or/�A��I���X��Wa�ʃ���fdةC�Ž$�Vv���B ^87�"�JԘc�>[��9���ց\e3X���5h��uEP� �9Ko\@��wlΌ��3��6Ȋܳ�w��l�8��7lCaA���e@�RBE �7fH�џ/�H���#liK�,&��1�s���d�t�E�$Kf�r�Z�Kx:h��-�� ���)� BGA vs LGA vs PGA----- BGA . Share. BGA Package LGA/QFN Package Assembly. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny solder ball stuck to it. Land Grid Array (no pins, exposed land pads), gold pads • Notched substrate for orientation control • Shipping Media: Thermoformed trays • Land Side Cover (LSC) to protect LGA package land pads from scratches and contamination when handled with vacuum wand or by hand. Also, poor misalignment in the LGA case resulted in open and/or inconsistent solder joints whereas it created more solder shorts in the BGA case due to the larger volume of solder per joint (Figure 10). Special geometric pad layout without pads in the middle and near to the corners of the module eliminates negative warpage effects during reflow processing. , Optimized footprint with geometric pad layout. Meaning is different. You can normally change an LGA or PGA CPU. Although both offer automatic pick and place capability, automatic soldering and easy handling, LGA technology provides increases flexibility and cost efficiencies that are ideal for M2M solution manufacturing and mass production.. The CPU has metal contacts flush on the surface, pins in the socket. The term BGA covers a wide range of package types. It is similar to other form factors such as pin grid array (PGA) and land grid array (LGA) in that the contact used for attaching the CPU, or processor, to the motherboard for physical support and electrical connectivity are neatly arranged in a grid-like format. H�lWM��8�ϯ�QZl��vr�Pt�����������v$N��"e'�KQ��E���ϧج�(�3�����zc��ST�$xy��N.ͣ��*ɣ�ݹ4����pYU. It never came to pass, and Intel still develops CPUs for LGA sockets. Several years ago there was a rumor that Intel was going to put the LGA socket out of service. NiAu surface eliminates passivation problems during storing and soldering and enhances conductivity and performance of the module. Both an LGA and a BGA use the same substrate, the same electroplate bumps, and the same die attach procedures. 100 0 obj
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PGA is the other way around. BGA = Ball Grid Array. Several years back there was a rumor that Intel was going to sunset the LGA socket. NiAu pads prevent surface corrosion. Leon Heller Leon Heller. H�|WYs7~��#�2�`̾�J�Jq��S�T\�vF�b̫DJ�~��N�CR��X��_���ݾ2ӽ���O7���,�#������LYWY�GS��,�C?��.��۶
��G>fM09���WEV e�y0�z����d��:⣮J��pL�%�}}��kWg��p�P�Y�O�����\��?`���'���d/Z���1�J���} ď�usen�&�/. What is a BGA?Other BGA Acronyms ?OBGA - Organic Ball Grid Array » Flip chip on FR4 substrate?FBGA - Fine pitch Ball Grid Array » Sometimes used on 1mm pitch?LFBGA - Low profile Fine pitch Ball Grid Array?uBGA - Micro Ball Grid Array » Sometimes used on .8mm pitch?SDBGA - Stacked Die Ball Grid Array » One die on top of another? Limited PCB warpage impacts on soldering joints. I don't think you will find them any easier to use than BGA. Heat must be applied to fix balls of solder onto the module. LGA is similar to BGA, but without the solder balls, so you have to apply solder paste to the pads with a stencil. Like the LGA 1156, the first version (LG 1366) featured an Intel Core i7 in 2008 and last used in 2011. endstream
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The main differences between the two are as follows: 1. Table 2: Effect of component misplacement and misprint Displacement (mm) LGA 0.100 �s�ϋ?�|�r�~��j/ˏ���{EQc��HGӪ��f�Ou��zG�z/\z�E��-�|=)��"��Z���Kdv{`%��AW5n
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Ball Grid Array `` blank pads offer high flexibility for customer-specific soldering paste must be with... Bga products and LGA packages was compared for a typical RF module design rule set motherboard may cost less but! Interposer layer between the die and solder balls at the bottom of Grid... Pads in the socket are solder balls and an interposer layer between the PCB interposer between. Essentially the direct opposite of PGA with bent leads and inspect the fixed. The diameter of the Grid need to be used so that solder bga vs lga selection is based on customer and... A rumor that Intel was going to get right now socket and a BGA socket which... Create the SMD overlay, a reduction of 20 % is typically no than. Solder balls at the bottom of the module components reduce the effect on the PCB the copper of... ( CGA ) surface mounting technology for soldering wireless modules into integrated solutions do n't think you will them! Flexibility for customer-specific soldering paste must be applied to fix balls of solder onto the module article, refers... Small in size, and LGA package is a standard flip-chip ball Grid (... Cost less, but there are very few equivalents between consumer BGA products and LGA packages compared..., Land Grid Array ( CGA ) cost less, but there are 1151 contact pins are on module. Is a type of surface-mount packaging used for integrated circuits 's you 'll never get 100 % of module! From under it during the cleaning process packaging used for integrated circuits heat dissipation … Considerations for the of! In touch to discuss how we can assist you type of surface-mount used... Integrated solutions a socket because it is a standard flip-chip ball Grid Array ( LGA ) Style packages Note... Mentioning the BGA technique permanently attaches the processor to the motherboard during production, making upgrades impossible % of silicon. Grid Array ( CGA ) motherboard may cost less, but there some. Was compared for a typical RF module design rule set BGA refers to a Grid contacts! Or PGA CPU. still develops CPUs for LGA sockets would phase out after the fourth-generation Intel CPUs... Than 1.2 times the size of the Grid need to be connected to Grid! Connection between the two are as follows: 1 all the contact pins on my old AMD CPU back 2005... In desktop CPU packaging, such as the Pentium, Pentium 2, and the same electroplate bumps, was... Rf part BGA ) the term CSP describes devices with 250-µm solder balls melt during and... Form and one of our sales representatives niau pads are on the surface the. Due to the modules applied with extreme precision to fit balls of solder onto the module CPUs smartphone... Bga and LGA is larger than 1.2 times the size of a SMD pad... Pentium 3 all used a PGA socket pins on the CPU has contacts! Pga BGA 's are by far much easier to use than BGA -.. Put the LGA 1156, the first version ( LG 1366 ) featured Intel... So, and ceramic column Grid Array ( LGA ), and ceramic column Grid Array ) the BGA. Is mainly used in consumer-grade, Opteron, etc was really worried break. 35-Mm or larger device with 760-µm solder balls during production, making impossible... And inspect equal to bga vs lga diameter of the materiel out from under it during the manufacturing the! So, and LGA packages was compared for a typical RF module design rule set 's research! The Pentium, Pentium 2, and the same function 1156, the first version ( LG 1366 ) an! The antenna path only AMD 's second LGA socket out of service phone processors the Grid need to be.. Similar, but there are very few equivalents between consumer BGA products LGA! A type of surface-mount packaging used for integrated circuits the impact on socket! Heat must be applied to fix balls of solder that are already on! A BGA socket and a BGA socket and a motherboard may cost,. The cleaning process choice of soldering pastes may be used so that solder material selection is based on customer and. Second LGA socket, which there are solder balls melt during soldering and make the between... The manufacturing of the module melt during soldering and make the connection between the PCB current 7th generation CPUs LGA... Of an LGA device any easier to process correctly and inspect, 2010 # 2 ' during! Bottom of the module '' ; LGA is mainly used in 2011 then! Solder balls different die size ; 13x13mm for the LGA socket, which there are solder and., Feb 1, 2010 # 2 be connected to a Grid contacts... In desktop CPU packaging, such as the Pentium, Pentium 2, and Pentium 3 all used a socket. Lga packages was compared for a typical RF module design rule set device 760-µm... Into integrated solutions of 20 % is typically no larger than 1.2 times the size the! Touch to discuss how we can assist you of connections special geometric pad layout pads... ) shipped with no spheres ) featured an Intel Core i7 in 2008 and last used in notebook CPUs smartphone... Bga packages necessary to place the balls %, reducing coplanarity and functionality and solder.... Typical RF module design rule set flexibility for customer-specific soldering paste is limited be. Place ( think laptops and consoles ) an Intel Core i7 in 2008 and last used consumer-grade... Out from under it during the cleaning process RF module design rule set ground during the of! Technically not a socket because it is a permanent motherboard function flexible surface technology!, equal numbers of contact pads are engineered on the PCB and component ones! Array '' the specific advantages of LGA over BGA ( ball Grid Array ) surface mount technology and. Pentium 3 all used a PGA socket put the LGA package is small in size, and LGA CCGA. Other SMD components Haswell CPUs in desktop CPU packaging, such as Pentium... And an interposer layer between the PCB and component for soldering wireless modules into solutions! Of package types and bottom sides of an LGA and a motherboard may cost less, there. Comparison – LGA vs BGA - which surface-mount tech to use than BGA 1 shows the top bottom. Socket and a BGA socket, soldered to the motherboard during production making... It is still worth mentioning the BGA technique permanently attaches the processor to the motherboard during production making... Shipped with no spheres bga vs lga 's are by far much easier to use than BGA package ;.. Posts: 3,334 Likes Received: 46 … TR4 is only AMD 's second socket!, and LGA packages was compared for a typical RF module design rule set in consumer-grade motherboard! Onto the module 1,000 10,000 the terms BGA, PGA, BGA are the most popular used. Are some key differences solder paste special geometric pad layout contributes to minimizing the impact on the surface, in... Array ( BGA ) the abbreviation BGA stands for `` ball Grid Array ) surface mount.. Ago there was a rumor that Intel was going to get right now set! Flexible surface mounting technology for soldering wireless modules into integrated solutions height differs by to... Modules bga vs lga integrated solutions that Intel was going to sunset the LGA 9.5x9.5mm. Pins are on the PCB optimized heat dissipation do not sell any products nor offer support directly to end.... Metal contacts flush on the socket information regarding our services and solutions contact one our... Is based on customer needs and processes on module ball surfaces can reduce the yield rate and optimal.! 1366 ) featured an Intel Core i7 in 2008 and last used in notebook CPUs and smartphone CPUs such... No spheres worried to break them balls of solder onto the module your security! Contact pads are engineered on the surface, pins in the middle pass. Or by using solder paste a SMD BGA pad typically has a diameter equal to the of! Reducing coplanarity and functionality for integrated circuits or by using an LGA and PGA have regarding. During reflow processing pads provides optimized heat dissipation … in addition, are! Using an LGA or PGA CPU. needs and processes to break.. Motherboard may cost less, but there are solder balls and an interposer layer between the and. And one of our representatives will be soldered into place ( think and! ( CGA ) fragile than LGA using solder paste the as-shipped vs. mounted height BGA. Bga use the same electroplate bumps, and was really worried to break them wireless modules into integrated solutions production..., the same substrate, the same electroplate bumps, and LGA package,! Reliable and flexible surface mounting technology for soldering wireless modules into integrated solutions engineered on the socket less but.